濺鍍系統（Sputtering Systems）
最先進濺鍍系統可使用各種腔體和源配置，以在直徑高達200毫米的基板上沉積金屬和介電薄膜。系統可配備直流、射頻和脈衝直流電源，實現連續或共濺鍍。系統配備渦輪分子泵套件，可實現5x10-7Torr的基本壓力。磁控靶與基板的距離可調節，以實現所需的均勻性和沉積速率。帶有偏置磁控靶的旋轉平台提供實現最佳薄膜均勻性的手段。提供晶體厚度監測器以實現自動終止加工。平台可加熱至800°C並進行射頻偏置。
功能說明
Electropolished 14” cubical chamber optimized for sputtering
5x10-7 Torr base pressure attained with turbomolecular pumping package
Single or multi magnetron configuration with varying target sizes
Sequential sputtering/co-sputtering
Adjustable magnetron to substrate distance
1” to 6” planar magnetron sizes
Source and substrate shutters
MFC with electro polished gas lines
4” viewport with manual shutter
Quartz crystal thickness sensor
Substrate rotation
Fully automated PC based, recipe driven
LabVIEW user interface
EMO protection and safety interlocks
5x10-7 Torr base pressure attained with turbomolecular pumping package
Single or multi magnetron configuration with varying target sizes
Sequential sputtering/co-sputtering
Adjustable magnetron to substrate distance
1” to 6” planar magnetron sizes
Source and substrate shutters
MFC with electro polished gas lines
4” viewport with manual shutter
Quartz crystal thickness sensor
Substrate rotation
Fully automated PC based, recipe driven
LabVIEW user interface
EMO protection and safety interlocks
規格說明
Optical coatings, and ITO Coatings
Hard coatings
Protective coatings
Microelectronics patterning
TCO in OLED applications
Hard coatings
Protective coatings
Microelectronics patterning
TCO in OLED applications
其他說明1
Options
Substrate heating up to 800°C or cooling
Glancing Angle Deposition (GLAD) with rotation
Custom chamber sizes
1.5-5kW Pulsed DC power supply for ITO/ZnO like materials
Tilted magnetrons
RF biased substrate
Ion source for substrate cleaning
Ion assisted sputtering
Additional RF nad DC power supplies for co-sputtering
Thermal and E-beam sources
Additional MFC’s for reactive sputtering
Automatic load/unload
Various pumping options including cryo pumping stations
Substrate heating up to 800°C or cooling
Glancing Angle Deposition (GLAD) with rotation
Custom chamber sizes
1.5-5kW Pulsed DC power supply for ITO/ZnO like materials
Tilted magnetrons
RF biased substrate
Ion source for substrate cleaning
Ion assisted sputtering
Additional RF nad DC power supplies for co-sputtering
Thermal and E-beam sources
Additional MFC’s for reactive sputtering
Automatic load/unload
Various pumping options including cryo pumping stations
