DRIE Systems
NANO-MASTER 的 DRIE 系統採用平面 ICP 源以產生高密度電漿。我們的系統能夠應用於 Cryo etch 和 Bosch 等製程，可以在晶圓上製造高深寬比的深入、陡峭的孔洞和槽。
Silicon wafer dicing.
MEMS
Deep trenches in Silicon etching
High precision motion sensors
Nano Scale Etching
Microfludics
MEMS
Deep trenches in Silicon etching
High precision motion sensors
Nano Scale Etching
Microfludics
NM-ICP downstream high density shower-head plasma source
Compatible with Bosch and Cryo etch processees
13" Aluminum hard anodized chamber
Reduced chamber volume ensuring high gas conductance and short step times
Up to 200mm substrates
Mechanical chuck with He backside cooling
1kW RF power supply with Auto Tuner for ICP source
600W RF power supply with Auto Tuner for substrate bias
RIE mode for low etch rate applications
PC based fully automatic recipe or manually driven control system
State of the art user interface
EMO protection and safety interlocks
Compatible with Bosch and Cryo etch processees
13" Aluminum hard anodized chamber
Reduced chamber volume ensuring high gas conductance and short step times
Up to 200mm substrates
Mechanical chuck with He backside cooling
1kW RF power supply with Auto Tuner for ICP source
600W RF power supply with Auto Tuner for substrate bias
RIE mode for low etch rate applications
PC based fully automatic recipe or manually driven control system
State of the art user interface
EMO protection and safety interlocks
OPTIONS
Electrostatic Chuck with He backside cooling
Extra MFC’s with SS gas lines
Auto L/UL
Spectroscopic end point detector
Electrostatic Chuck with He backside cooling
Extra MFC’s with SS gas lines
Auto L/UL
Spectroscopic end point detector
