原子層沉積系統（Atomic Layer Deposition ）
NLD-4000是一款獨立的PC控制ALD系統，具有全自動化和安全互鎖功能，可用於半導體、光伏和MEMS應用中沉積氧化物和氮化物（例如AlN、GaN、TaN、TiN、Al2O3、ZrO2、LaO2、HfO2）。它具有一個13英寸的鋁反應室，帶有加熱牆和氣壓升降式頂部，便於進行室內操作。該系統設有一個內置的手套箱，可容納多達七個加熱或冷卻的50毫升的氣缸，用於儲存前驅物和反應物，採用脈衝快速傳送閥進行脈衝氣體輸入。未反應的前驅物可以通過室內排氣口的加熱過濾器捕獲。溫度設定點、氣體流量、泵下和通風循環以及傳輸線的清洗都通過LabVIEW軟體自動控制。選項包括自動裝載/卸載（不改變系統佔地面積）、帶遠程電漿的平面ICP源，用於電漿增強ALD（平面ICP幾何形狀保持小的反應室體積，以實現更快的週期時間）以及低基礎壓力的渦輪分子泵。
功能說明
High-k dielectrics
Hydrophobic coating
Passivation layer
High aspect ratio diffusion barriers for Cu interconnects
Conformal coatings for micro fluidics applications
Fuel cells, e.g. single metal coating for catalyst layers
Hydrophobic coating
Passivation layer
High aspect ratio diffusion barriers for Cu interconnects
Conformal coatings for micro fluidics applications
Fuel cells, e.g. single metal coating for catalyst layers
規格說明
Less than 1Å uniformity
13" anodized Al chamber
Minimal volume for fast cycle time and throughput
Up to 8" substrate
Heated chamber walls
400°C substrate heater
Onboard precursor glovebox
Up to seven 50cc precursor cylinders
300 l/sec maglev turbomolecular pumping package
5×10-7 torr base pressure
Fast pulse gas delivery valves
Large area filter to capture unreacted precursors
Large area filter to capture unreacted precursors
High aspect ratio structure coating
Fully automated PC based, recipe driven
LabVIEW user interface
Computer controlled safety interlocks
26"x44" footprint with enclosed panels ideal for clean rooms
13" anodized Al chamber
Minimal volume for fast cycle time and throughput
Up to 8" substrate
Heated chamber walls
400°C substrate heater
Onboard precursor glovebox
Up to seven 50cc precursor cylinders
300 l/sec maglev turbomolecular pumping package
5×10-7 torr base pressure
Fast pulse gas delivery valves
Large area filter to capture unreacted precursors
Large area filter to capture unreacted precursors
High aspect ratio structure coating
Fully automated PC based, recipe driven
LabVIEW user interface
Computer controlled safety interlocks
26"x44" footprint with enclosed panels ideal for clean rooms
其他說明1
Options
Downstream planar inductively coupled remote plasma source for PE-ALD process
Auto load/unload
Additional precursors
Downstream planar inductively coupled remote plasma source for PE-ALD process
Auto load/unload
Additional precursors
